and bare die for flexible adaptation. 4. Modular configuration with fluorescence and SSI enhances photoresist residues and RDL anomalies detection capabilities. 5. Compatible with deep learning algorithms for efficient and accurate ADC services. 6. Multi-dimensional measurement result evaluation and display for rapid process issue identification. ，。

it is suitable for wafers with significant warpage. The software is equipped with ADC functionality， DTD， applicable to front-end process and advanced packaging fields. Product Features 1. Sub-micron level front-side wafer defect detection equipment. 2. Real-time auto-focus ensures efficient and stable detection. 3. Supports algorithms including Golden， supporting online automatic defect classification and filtering. It is equipped with a fluorescence and SSI optical detection system to address fine line width RDL detection， dicing channel， large chromatic aberration， effectively supporting inspection of each layers in 2.5D/3D advanced packaging， CTC， Product Introduction This series is primarily applied to the detection of sub-micron level defects on patterned wafer surfaces. It adopts the technology of a multi-mode bright and dark field optical system and is equipped with lenses of various magnifications to meet diverse precision requirements. It provides sub-micron level two-dimensional detection for various process inspections and final inspections in wafer manufacturing. With high-speed auto-focus capabilities。

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